Product description: Easy Print Sn96.5 Ag3 Cu0.5 soldering paste - 20 g
Lead-free agent used for soldering in SMD surface mounting, ensuring high quality connections. Its chemical composition is Sn96.5 Ag3 Cu0.5 . The paste is used as an intermediary between electronic components and solder alloy to facilitate the soldering process and ensure a durable connection . It perfectly counteracts the phenomenon of balling, making it an ideal choice for applications requiring precision. It retains its properties even after 20 hours of application. The product is in a 20 g package.
Easy Print Sn96.5 Ag3 Cu0.5 soldering paste - 20 g.
Easy Print Paste is a No Clean product and generally does not require washing. If necessary, it is recommended to use an alcohol PCB remover .
Technical product specifications
- Type: soldering paste
- Binder composition: Sn96.5 Ag3 Cu0.5
- Density: ~ 4.6 g/cm 3
- Grain size: 25-45 μm
- Stickiness: 1 g/mm 2 after 24 h
- 20g package
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