Product description: Easy Print Sn96.5 Ag3 Cu0.5 soldering paste - 20 g
A lead-free agent used for soldering in SMD surface assembly, ensuring high-quality connections. Its chemical composition is Sn96.5 Ag3 Cu0.5 . The paste is used as an intermediary between electronic components and the solder to facilitate the soldering process and ensure a durable connection . It perfectly counteracts the phenomenon of peening, which makes it an ideal choice for applications requiring precision. It retains its properties for up to 24 hours after application. The product comes in a 20 g package.
Easy Print Sn96.5 Ag3 Cu0.5 soldering paste - 20 g.
Easy Print paste is a No Clean product and generally does not require washing. If necessary, it is recommended to use an alcohol-based PCB remover .
Product technical specifications
- Type: Soldering paste
- Binder composition: Sn96.5 Ag3 Cu0.5
- Density: ~ 4.6 g/ cm3
- Grain size: 25-45 μm
- Stickiness: 1 g/mm 2 after 24 h
- 20 g package
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