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Product description: AGX Orin Developer Kit 32 GB - NVIDIA Jetson AGX Orin development kit - Seeedstudio 110991725
The development of the AGX Orin Developer Kit is a powerful step forward for Robotics and Artificial Intelligence Edge : performance reaches up to 275 TOPS and is 8 times that of the NVIDIA Jetson AGX Xavier. The development kit includes a Jetson AGX Orin module with large heatsink and carrier plate, 802.11ac / abgn wireless network interface controller, USB Type-C power supply and cable. The module is equipped with a graphics processor with NVIDIA Ampere architecture, has an ARM Cortex - A78AE processor , as well as deep learning and next-generation vision accelerators. High-speed I / O ports, 204 GB / s memory bandwidth and 32 GB RAM memory can power multiple AI applications running in parallel. With Jetson AGX Orin, developers can now implement large and extremely complex models to solve problems such as natural language understanding, 3D perception, and multiple sensor fusion.
Special features of the set
- Supplied in a compact housing.
- Configurable power in the range from 15 W to 50 W.
- The new NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 Tensor cores is used, has a 12-core 64-bit ARM Cortex-A78AE v8.2 3 MB L2 + 6 MB L3 processor.
- It has 64 GB eMMC onboard, 204 GB / s memory bandwidth.
- It has 32 GB RAM memory.
- Series of I / O: 22 lanes of PCIe Gen4, Gigabit Ethernet, 4 XFI interfaces for 10 Gigabit Ethernet, Display Port, 16 MIPI CSI-2 lanes, USB3.2 interfaces and a 40-pin connector.
- Next generation vision accelerator included: PVA v2 and multi-standard video encoder and decoder
- The latest Jetpack 5.0 supports the entire NVIDIA JetPack platform and custom for use, including Isaac for robotics and Metropolis for smart cities.
NVIDIA software
All NVIDIA Jetson series modules and development kits are supported by the NVIDIA software stack, which enables software development and deployment on any device. Jetson software is designed to end-to-end acceleration of AI applications and to shorten the time of their prototyping processes.
Kit contents
- Jetson AGX Orin module
- Efficient heat sink
- Power Supply
- USB cables
- Quick reference guide
Technical specification of the module
- SI Performance: 275 TOPS (INT8)
- GPU: NVIDIA Ampere with 2048 cores and 64 Tensor cores
- Maximum GPU frequency: 1 GHz
- CPU: Dual-core 64-bit ARM Cortex-A78AE v8.2 processor with 3MB L2 cache and 6MB L3
- Processor maximum frequency: 2 GHz
- GU accelerator: 2x NVDLA v2
- Vision accelerator: 1x PVA v2
- Memory RAM: 32 GB 256-bit LPDDR5 204.8 GB / s
- Mass memory: 64 GB, eMMC 5.1
- Camera support:
- up to 6 cameras (16 via virtual channels)
- 16 MIPI CSI-2 tracks
- D-PHY 2.1 (up to 40 Gbps) | C-PHY 2.0 (up to 164 Gbps)
- Video encoding:
- 2x 4K60 (H.265)
- 4x 4K30 (H.265)
- 8x 1080p60 (H.265)
- 16x 1080p30 (H.265)
- Video decoding:
- 1x 8K30 (H.265)
- 3x 4K60 (H.265)
- 7x 4K30 (H.265)
- 11x 1080p60 (H.265)
- 22x 1080p30 (H.265)
- UPHY:
- PCIe: up to 2 x8 + 2 x4 + 2 x1 (PCIe Gen4, main and end port)
- 3x USB 3.2
- Single-lane UFS
- Network solutions:
- 1x GbE
- 4x 10 GbE
- Display: 1x 8K60 multi-mode DP 1.4a (+ MST) / eDP 1.4a / HDMI 2.1
- Power consumption: 5 W | 30 watts | 50 W (up to 60 W maximum)
- 699 Pin Molex Mirror Mezz Connector
- Integrated thermal conductive plate
- Dimensions: 100 x 87 mm