Stands for IC

Socket for chips in different packages

The assortment of our shop you can find coasters of chips designed for different integrated circuit. Provided for installation problems, that is, one in which the legs of the e-pass through holes in the printed circuit Board and connected to the fields lutowniczymi using the tin with one (typically lower) side or two. In the case of use of a stand lutuje it in the space reserved for the installation of the layout, and the layout itself is placed in the holes of the stand. Such mounting elements are often used on expensive items so as not to damage them by soldering, and also the elements are often referred to, for example, in working with the program processor in embedded systems.

Versatile and inexpensive stand DIP

The simplest podstawkami under ICS are the so-called DIP stand, designed to accommodate systems in the case of the same name. DIP, i.e., Dual In-line Package housing with two rows of contacts. The legs of the chips in PDIP usually have a pitch of 2.54 mm, i.e., 0.1 inch. The muffin chips in PDIP are similarly located slots, including the metal, spring-loaded elements. Considerable force of these springs to the metal leads of the chip ensures a perfect electrical contact between the contact and socket in the stand, even after repeated installing and retrieving the item from the holder.

Special supports ZIF for soft components

Another option panels for chips, the so-called ZIF socket (Zero Insertion Force), i.e., zero force required to turn on the system. Thanks to their design the pressure on the contacts of the chips is carried out only after the locking of the stand using the special lever. At the moment when the lever is released the system is inserted into the holes in the stand without resistance. This kind of support under the chip is used most often in devices such as dongles memory or microcontrollers, as a stand ZIF can survive a lot more cycles to insert and remove a chip than a regular DIP stand.