Product description: SparkFun 6DoF IMU Breakout - LSM6DSV16X - 3-axis accelerometer and gyroscope - Qwiic - SparkFun SEN-21325
SparkFun 6DoF IMU Breakout LSM6DSV16X Qwiic is a modern inertial IMU sensor module that focuses on position determination. The sensor has a 3-axis digital accelerometer and gyroscope and provides detailed motion analysis in six degrees of freedom . Additionally, the sensor has an intelligent FIFO memory with a capacity of 4.5 kB , which allows for effective handling of large amounts of data without loading the main system processor. Designed with mobile applications in mind, the sensor is compatible with Android and offers a wide range of acceleration and angular velocity measurements, making it suitable for advanced navigation systems.
Our offer also includes the SparkFun Micro 6DoF IMU Breakout version. Check!
SparkFun 6DoF IMU Breakout - LSM6DSV16X - 3-axis accelerometer and gyroscope - Qwiic - SparkFun SEN-21325.
The board has an accelerometer and a gyroscope to detect motion.
Main features of the development board
- Enables integration with AI systems
- It has two I2C addresses: default 0x6B and 0x6A, which facilitates integration with various systems
- It contains an advanced LSM6DSV16X IMU system, which guarantees measurement reliability and accuracy
- Offers triple cores for UI data processing, EIS electronic image stabilization and OIS optical image stabilization
- It is compatible with Android, which makes it easy to integrate with mobile devices
- Allows full scale adjustments for accelerometer and gyroscope
Triple data processing cores
The device also has triple cores for data processing. Each core is dedicated to different tasks - one handles UI user interactions, the second deals with electronic image stabilization EIS, and the third is responsible for optical image stabilization OIS . This configuration allows for precise processing of motion data, from detecting user gestures to advanced image stabilization in mobile devices and cameras.
The device has a built-in FIFO memory with a capacity of 4.5 kB.
Technical specifications of the board
- Built-in chip: LSM6DSV16X
- Module type: IMU sensor
- Degrees of freedom: 6
- Sensor: 3-axis digital accelerometer and gyroscope
- Data Processing: Uses triple cores to process UI, EIS and OIS data
- Interface: I2C with addresses 0x6B (default) and 0x6A
- Acceleration measurement range: ±2 / ±4 / ±8 / ±16 g
- Angular velocity measurement range: ±125 / ±250 / ±500 / ±1000 / ±2000 /±4000 dps
- FIFO capacity: intelligent FIFO up to 4.5 kB
- Supply voltage: 1.71V to 3.6V
- Built-in temperature sensor: yes
- Android compatibility: yes
- Step counter: yes
- Pins: 2x Qwiic connector, soldering pads
- Dimensions: 25.4 x 25.4 mm
Useful links |
