- EOL
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Description
Two-component resin for pouring and encapsulating entire components in electronics, tele- and radiotechnics. It has very good electro-insulating properties and good adhesion to all material groups.
Specification
- Viscosity at 25 °C: 900 ÷ 1500[mPa∙s].
- Density at 20 °C: 1.11 ÷ 1.15[g/cm³].
- Epoxy number: min. 0.410[mol/100g]
- Form: liquid
- Operating temperature: >110 °C
Attention! The product is irritating to eyes and skin. |
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