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Product description: SparkFun IR Array Breakout - module with IR MLX90640 thermal imaging camera - FOV 110 - Qwiic - SparkFun SEN-14843
The module is equipped with a thermal imaging camera - an infrared IR sensor with the MLX90640 system. The heat sensing matrix has a resolution of 32 x 24 pixels. The temperature measurement angle of the camera is 110 ° x 75 °. The device is able to measure the temperature in the range from -40 ° C to 300 ° C with an accuracy of +/- 1.5 ° C. The module uses the I2C communication interface. It has a Qwiic connector that does not require soldering and is an alternative to standard solder pads.
A detailed user guide is available on the manufacturer's website - check it out!
Data presentation.
Specification of the module with an IR thermal imaging camera
- Built-in chip: MLX90640
- Supply voltage: from 3 V to 3.6 V
- Current consumption: approx. 18 mA
- Measurement range: -40 ° C to 300 ° C
- Measurement accuracy: +/- 1.5 ° C (in the range from 0 ° C to 100 ° C)
- FOV viewing angle: 110 ° x 75 °
- IR matrix: 32 x 24
- Programmable refresh rate: 0.5 Hz to 64 Hz (0.25 fps to 32 fps)
- Communication interface: I2C bus
- I2C interface address: 0x33
- 2x Qwiic connectors
Description of the module pins
- GND - the ground of the system
- 3.3V - power pin
- SDA - data line of the I2C bus
- SCL - clock line of the I2C bus
More information on how to connect can be found here .
SparkFun IR Array Breakout has a high demand of RAM and Flash memory to perform the necessary calculations. Main modules based on microcontrollers with less memory, eg Arduino UNO, may be insufficient to support the MLX90640 sensor. The manufacturer recommends using systems with more memory. When using Arduino , a minimum of 20 KB of RAM is required - SAMD21 (M0) or SAMD51 (M4).
SparkFun IR Array Breakout - module with IR MLX90640 thermal imaging camera - FOV 110 - Qwiic - SparkFun SEN-14843.
